Ultra-thin cobalt silicide nanoflakes outperform copper in electronics

Lab-tested material could slash electronics costs by enabling thinner, more efficient circuits

Researchers synthesized cobalt silicide nanoflakes just 20 nanometers thick that conduct electricity 10 times better and carry 100 times more current than copper interconnects of identical thickness at room temperature. These flakes maintain structural stability at 450°C for 200 hours and transmit signals with minimal loss up to 40 gigahertz—verified through ground-signal-ground configuration tests. The material was tested in Nature Materials (2026) as a potential replacement for copper in integrated circuits, with thickness scalable from 1 micrometer down to 20 nanometers. This could enable cheaper, more efficient electronics by reducing material costs and heat generation in chips. The source provides limited detail on cost implications and real-world deployment timelines. The source is brief and the detail sits with them.

Source: ScienceAlert